TCS 1500 thermal interface pad is a silicone rubber material specially formulated for use in high performance devices requiring minimum thermal resistance. These pads consist of a 0.5mm~10mm thick, electrically non-conductive, TCS 1500 is an elastomeric pad that can yield a very thin bondline between mating surfaces.   The materials is a filled，thermally conductive polymer. The conformable nature of TCS allows the pad to fill in air gaps between PC oards and heat sinks or a metal chassis.

TCS material has an inherently adhesive or “sticky” texture which allows for easy attachment to a variety of heat sink or component surfaces.   Apply to heat sink by removing the TCS pad from its carrier strip, position the pad and press in place onto the heat sink.   The clear protective top liner must be removed prior to mounting the heat sink onto the component (microprocessor, for example) to be cooled. If heat sink must be removed for rework or replacement, the TCS pad can be removed using a single edged razor and then wiping the surface with isopropanol (IPA) solvent