TCS7000 thermal pad

TCS7000 thermal pad are soft gap-filling materials for high-performance applications requiring low assembly stress. These materials offer exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The TCS7000 gap-filling materials are highly conformal to rough or irregular surfaces and allow excellent wet-out at the interface. These materials feature 7W/m·k thermal conductivity. The TCS7000 gap-filling materials operate at -60°C to +200°C temperature range. These materials offer a UL 94 V-0 flammability rating.

FEATURES

Low assembly stress due to ultra-low modulus

Excellent conformability to rough or irregular surfaces

Thorough wet out at the interface for maximized thermal transfer

High thermal conductivity

Simplified application and processability

Ultra-low modulus

High compliance

Protective liners for easy usage

APPLICATIONS

Telecommunications:

Routers

Switches

Base stations

ASICs and DSPs

Consumer electronics

Thermal modules to heat sinks assembly

SPECIFICATIONS

7W/m∙K thermal connectivity

152kPa Young's modulus

UL 94 V-0 flammability rating

-60°C to +200°C operating temperature range