Features and Benefits

•Excellent thermal conductivity, low thermal impedance

•Good thixotropy, operating easily

•Low sedimentation, good chemical and mechanical stability•Good crumpling resistance, high reliability in long-term work•Suitable for silk-screen printing process

Specification

TGC6000SF is a thermally conductive grease compound designedfor useasa thermal interface material between a high-power electroniccomponentand a heat sink.

TGC6000SF compound wets-out the thermal interfaces and flowstoproducevery low thermal impedance. The compound is able to cool theelectroniccomponents quickly and efficiently, in order to extend their shelflife and

improve reliability.

TGC6000SF is highly stabile from -45℃to 200℃, and has goodweatherability as well as dielectric properties, in addition to the good thermalconductivity, which will not produce the pressure when use. The compoundmeets the requirements of electronics industries as a thermally conductiveinterface material.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components

Packaging Related

•Canning Form

•Packing Specification

Weight: 1kg/can

Storage

•Shelf Life: 12 months

•Storage Conditions:

Temperature: 15℃< T < 30℃

Relative Humidity: RH < 70%

Note: Stirring uniformly before use when finding any sedimentation