Features and Benefits

•Excellent thermal conductivity, low thermal impedance

•Good thixotropy, operating easily

•Low sedimentation, good chemical and mechanical stability•Good crumpling resistance, high reliability in long-term work•Suitable for silk-screen printing process

Specification

TGC4000SF is a thermally conductive grease compound designed for useasa thermal interface material between a high-power electroniccomponentand a heat sink.

TGC4000SF compound wets-out the thermal interfaces andflowstoproducevery low thermal impedance. The compound is able to coolthe electroniccomponents quickly and efficiently, in order to extend theirshelf life andimprove reliability.

TGC4000SF is highly stabile from -45℃to 200℃, and has goodweatherability as well as dielectric properties, in addition to the good thermalconductivity, which will not produce the pressure when use. The compoundmeets the requirements of electronics industries as a thermally conductiveinterface material.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components