Features and Benefits

•Good thermal conductivity, low thermal impedance

•Good thixotropy, operating easily

•Low sedimentation, good chemical and mechanical stability•Good crumpling resistance, high reliability in long-term work•Suitable for silk-screen printing process

Specification

TGC2000SF is a thermally conductive grease compound designedfor useas a thermal interface material between a high-power electroniccomponent and a heat sink.

TGC2000SF compound wets-out the thermal interfaces and flowstoproduce very low thermal impedance. The compound is able to cool theelectronic components quickly and efficiently, in order to extend their shelf

life and improve reliability.

TGC2000DF is highly stabile from -45℃to 200℃, and has goodweatherability as well as dielectric properties, in addition to the goodthermalconductivity, which will not produce the pressure when use. Thecompoundmeets the requirements of electronics industries as a thermallyconductiveinterface material.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components