Features and Benefits

•Fill large gaps while providing superior thermal transfer

•No curing with high reliability

•Working well on the irregular structure gap

•Resistant to high strength

•Excellent mechanical property and weather resistance

Specification

Gel 6500 is a thermally conductive, form-in-place, liquid gap fillingmaterial.Gel 6500   possesses excellent structural applicability and ultraconforming property,   as well as fills the gaps fully, for components such asa heat sink,   uneven ceramic or irregular cavity.

Gel 6500 is resistant to high voltage and has good thermostability, whichallows its safety and reliabilty.

Gel 6500 flows under pressure like grease and will not cure as aresult ofthermal cycling.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components

•Security Equipment