Features and Benefits

•Fill large gaps while providing superior thermal transfer

•No curing with high reliability

•Working well on the irregular structure gap

•Resistant to high strength

•Excellent mechanical property and weather resistance

Specification

Gel 5000 is a thermally conductive, form-in-place, liquid gap fillingmaterial.Gel 5000   possesses excellent structural applicability and ultra-conforming property,   as well as fills the gaps fully, for components such asa heat sink,   uneven ceramic or irregular cavity.

Gel 5000 is resistant to high voltage and has good thermostability,whichallows its safety and reliabilty.

Gel 5000 flows under pressure like grease and will not cure as aresult ofthermal cycling.

Typical Applications

•Communication Equipment

•Network Terminal

•Storage Device

•LED

•Consumer Electronics

•Power Components

•Security Equipment